Interferometric Thickness Sensor
I-series spectroscopic interferometric thickness sensor
Model：I系列白光干涉测厚仪
The I-series white light interferometric thickness gauge adopts the principle of spectroscopic interferometry. By analyzing the interference signals formed by the reflected light from the upper and lower surfaces of the thin film, it achieves high-precision non-contact measurement of the thickness of transparent and semi-transparent thin films and coatings. The product features nanometer-level repeatability, a maximum sampling speed of 10 kHz, and a wide working distance range. It is suitable for thickness measurement of PCB protective coatings, PET multilayer films, UTG ultrathin flexible glass, wafer bonding layers, TSV through-silicon vias, and during grinding and polishing processes.
Send InquiryKey Features
- • Utilizing the principle of spectroscopic interference, this method is suitable for measuring the thickness of thin films and coatings. It employs non-contact measurement, avoiding damage to the surface of the material being measured. Repeatability up to 1 nm, suitable for nanometer-level thickness detection, linear accuracy up to ±20 nm, and high measurement stability, allows for sampling speeds up to 10 kHz, making it suitable for online inspection scenarios. It supports thickness measurement of transparent and semi-transparent materials and multilayer films. A wide working distance range facilitates integration with automated equipment. Strong anti-interference capabilities make it suitable for continuous inspection in industrial settings.
Applications
- • PCB protective coating thickness measurement
- • PET multilayer film thickness measurement
- • UTG ultrathin flexible glass thickness measurement
- • Transparent film and coating thickness inspection
- • Advanced packaging process wafer bonding layer thickness measurement
- • TSV through-silicon via depth inspection
- • Wafer grinding and polishing process thickness monitoring
- • Semiconductor packaging material thickness inspection
- • Online thickness measurement on automated production lines
Specifications
Full specification text
I系列白光干涉测厚仪参数表
| 型号 | IVS-100 | IVS-100W | IVS-50 | IVS-50W |
|---|---|---|---|---|
| 控制器型号 | IVCS-100 | IVCS-100W | IVCS-50 | IVCS-50W |
| 适配探头型号 | IRVP-TVF | IVP-T10-UV-VIS | IRVP-TVF | IVP-T10-UV-VIS |
| 建议工作距离 | 55 mm ±2 mm | 非聚焦探头，安装距离 5 至 10 mm | 55 mm ±2 mm | 非聚焦探头，安装距离 5 至 10 mm |
| 测量角度 | ±5° | ±10° | ±5° | ±10° |
| 光斑类型 | 聚焦光斑，Φ100 μm | 弥散光斑，在10 mm安装距离时光斑直径约为4 mm | 聚焦光斑，Φ100 μm | 弥散光斑，在10 mm安装距离时光斑直径约为4 mm |
| 探头外径×长度 | Φ20×73 mm | Φ6.35×3200 mm | Φ20×73 mm | Φ6.35×3200 mm |
| 探头重量 | 108 g | 190 g | 108 g | 190 g |
| 探头防护等级 | IP40 | IP40 | IP40 | IP40 |
| 可连接传感头数 | 1 | 1 | 1 | 1 |
| 测厚范围 | 约2 μm～100 μm，折射率1.5时 | 约2 μm～100 μm，折射率1.5时 | 约1 μm～50 μm，折射率1.5时 | 约1 μm～50 μm，折射率1.5时 |
| 重复精度 | 1 nm | 1 nm | 1 nm | 1 nm |
| 线性误差 | ＜±20 nm | ＜±20 nm | ＜±20 nm | ＜±20 nm |
| 采样频率 | Max.10 kHz | Max.10 kHz | Max.10 kHz | Max.10 kHz |
| 编码器输入 | AB / ABZ编码器输入，可配置用于触发 | AB / ABZ编码器输入，可配置用于触发 | AB / ABZ编码器输入，可配置用于触发 | AB / ABZ编码器输入，可配置用于触发 |
| 触发信号输入 | 脉冲 / 电平触发 | 脉冲 / 电平触发 | 脉冲 / 电平触发 | 脉冲 / 电平触发 |
| 数字信号输出 | 警报输出、比较器输出 | 警报输出、比较器输出 | 警报输出、比较器输出 | 警报输出、比较器输出 |
| 模拟信号输出 | 线性0～5V / 0～10V / ±5V / ±10V模拟电压输出，4～20 mA模拟电流输出 | 线性0～5V / 0～10V / ±5V / ±10V模拟电压输出，4～20 mA模拟电流输出 | 线性0～5V / 0～10V / ±5V / ±10V模拟电压输出，4～20 mA模拟电流输出 | 线性0～5V / 0～10V / ±5V / ±10V模拟电压输出，4～20 mA模拟电流输出 |
| Ethernet接口 | 100BASE-TX | 100BASE-TX | 100BASE-TX | 100BASE-TX |
| USB接口 | 符合USB2.0 Full-speed标准 | 符合USB2.0 Full-speed标准 | 符合USB2.0 Full-speed标准 | 符合USB2.0 Full-speed标准 |
| RS485接口 | Modbus协议，19200～115200波特率 | Modbus协议，19200～115200波特率 | Modbus协议，19200～115200波特率 | Modbus协议，19200～115200波特率 |
| 上位机软件 | TSConfocalStudio测控软件 | TSConfocalStudio测控软件 | TSConfocalStudio测控软件 | TSConfocalStudio测控软件 |
| 二次开发包 | C++及C#软件开发包 | C++及C#软件开发包 | C++及C#软件开发包 | C++及C#软件开发包 |
| 电源电压 | 24 VDC±10% | 24 VDC±10% | 24 VDC±10% | 24 VDC±10% |
| 电流消耗 | 约0.4 A | 约0.4 A | 约0.4 A | 约0.4 A |
| 工作温度 | 0 至 +50℃ | 0 至 +50℃ | 0 至 +50℃ | 0 至 +50℃ |
| 相对湿度 | 20 至 85%RH，无冷凝 | 20 至 85%RH，无冷凝 | 20 至 85%RH，无冷凝 | 20 至 85%RH，无冷凝 |
| 控制器重量 | 约2000 g | 约2000 g | 约2000 g | 约2000 g |
Model Selection
Full model selection text
I系列白光干涉测厚仪选型表
| 选型方向 | 推荐型号 | 适配探头 | 测厚范围 | 适合场景 |
|---|---|---|---|---|
| 高精度薄膜测厚 | IVS-100 | IRVP-TVF | 约2 μm～100 μm | 透明薄膜、涂层、PET膜、PCB保护涂层测厚 |
| 宽光斑柔性材料测厚 | IVS-100W | IVP-T10-UV-VIS | 约2 μm～100 μm | UTG玻璃、柔性膜材、表面不均匀材料测厚 |
| 薄膜小量程测厚 | IVS-50 | IRVP-TVF | 约1 μm～50 μm | 较薄膜层、涂层、胶层及精密材料厚度检测 |
| 小量程宽光斑测厚 | IVS-50W | IVP-T10-UV-VIS | 约1 μm～50 μm | 超薄柔性玻璃、薄膜材料、透明涂层在线检测 |
选型建议
IVS-100和IVS-50采用IRVP-TVF聚焦光斑探头，光斑直径约Φ100 μm，适合局部区域、高精度薄膜和涂层厚度检测。IVS-100W和IVS-50W采用IVP-T10-UV-VIS非聚焦弥散光斑探头，在10 mm安装距离时光斑直径约4 mm，更适合柔性玻璃、膜材、涂层不均匀或需要平均厚度测量的场景。若测厚范围在2～100 μm，优先选择IVS-100或IVS-100W；若测厚范围在1～50 μm，优先选择IVS-50或IVS-50W。