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Industry-based application content with inspection challenges, measurement solutions and recommended products.

3C Electronics
ST-P Series Laser Displacement Sensor in PCB Thickness and Substrate Height Measurement
A non-contact ST-P laser displacement setup measures PCB thickness, substrate height, component height and board warpage in-line. The solution combines model selection by working distance with high-speed acquisition and PLC or host-computer integration.

3C Electronics
ST-P Series Laser Displacement Sensor in PCB Solder Joint Height Inspection
This application outlines a non-contact displacement measurement approach for st-p series laser displacement sensor in pcb solder joint height inspection, including installation, acquisition, and result verification.

3C Electronics
ST-P Series Laser Displacement Sensor for PCBA Warpage Detection
This application outlines a non-contact displacement measurement approach for st-p series laser displacement sensor for pcba warpage detection, including installation, acquisition, and result verification.

3C Electronics
ST-P Series Laser Displacement Sensor for Online PCB Component Height Inspection
This application outlines a non-contact displacement measurement approach for st-p series laser displacement sensor for online pcb component height inspection, including installation, acquisition, and result verification.
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