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Applications
Industry-based application content with inspection challenges, measurement solutions and recommended products.
3C Electronics
ST-P Series Laser Displacement Sensor in Mobile Phone Middle Frame Step Detection
For step inspection between a mobile-phone middle frame and adjacent display or back-cover surfaces, this article explains ST-P point layout and datum compensation around material boundaries, chamfers, part tilt, and inline cycle time.
3C Electronics
ST-P Series Laser Displacement Sensor for Mobile Phone Battery Compartment Flatness Inspection
For flatness and local-deformation inspection of a mobile battery-compartment floor, this article explains ST-P multipoint layout, datum fitting, occlusion avoidance, and validation on different recessed surfaces.
3C Electronics
ST-P Series Laser Displacement Sensor for Mobile Phone Frame Flatness Measurement
For flatness inspection along narrow mobile-phone frame rails and corners, this article describes a common datum, multipoint or scanning layouts, and methods for managing metal texture and mechanism vibration with ST-P sensors.
3C Electronics
ST-P Series Laser Displacement Sensor in FPC Warpage and Height Detection
For FPC warpage and local-height inspection after mounting, soldering, or assembly, this article describes datum creation, grid sampling, surface-validation, and production-line integration with an ST-P laser displacement sensor.
3C Electronics
ST-P Series Laser Displacement Sensor in Connector Pin Height Inspection
For inline connector-pin height and coplanarity inspection, this article explains how to configure an ST-P laser displacement sensor around pin width, plated-surface reflectivity, datum definition, and scan path, with practical guidance for point selection, installation, and PLC decisions.
3C Electronics
ST-P Series Laser Displacement Sensor for Flatness Measurement of Tablet PC Enclosures
For large-area flatness inspection of metal or plastic tablet enclosures, this article explains the choice between ST-P multi-head arrays and scanning, common-datum calibration, surface-texture validation, and inline data processing.
3C Electronics
ST-P Series Laser Displacement Sensor for Notebook Enclosure Step Detection
For inline step inspection at notebook A/C/D covers, touchpads, and hinge joints, this article explains how to configure an ST-P laser displacement sensor around surface reflectivity, edge geometry, working distance, and production cycle time, with practical guidance on datum setup, point selection, model choice, and PLC integration.
3C Electronics
ST-P Series Laser Displacement Sensor in PCB Thickness and Substrate Height Measurement
A non-contact ST-P laser displacement setup measures PCB thickness, substrate height, component height and board warpage in-line. The solution combines model selection by working distance with high-speed acquisition and PLC or host-computer integration.
3C Electronics
ST-P Series Laser Displacement Sensor in PCB Solder Joint Height Inspection
This application outlines a non-contact displacement measurement approach for st-p series laser displacement sensor in pcb solder joint height inspection, including installation, acquisition, and result verification.
3C Electronics
ST-P Series Laser Displacement Sensor for PCBA Warpage Detection
This application outlines a non-contact displacement measurement approach for st-p series laser displacement sensor for pcba warpage detection, including installation, acquisition, and result verification.
3C Electronics
ST-P Series Laser Displacement Sensor for Online PCB Component Height Inspection
This application outlines a non-contact displacement measurement approach for st-p series laser displacement sensor for online pcb component height inspection, including installation, acquisition, and result verification.
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